I have been wondering about the cause of the infamous BCC inlay problems for a while. I never gave it that much thought, but after reading the thread about warped inlays on the BCC PNY commemorative chips (
http://www.chiptalk.net/forum/custom-chips-general/38223-warped-bccs.html), I really became intrigued. A discussion on possible causes for the inlay problems has started in the other thread, but I thought it might be appropriate to start a new thread on this topic.
BCC apparently has always had problems with the roundness of their inlays in the past. Instead of being perfectly round, the inlays are often egg-shaped or otherwise distorted. In addition, you can sometimes see a white ring on the edge of the inlays. The inlays are also often off-center, but that issue is not unique to BCC chips. The other problems are, though.
Inlays on Paulson or ASM chips always seem to be perfectly round, so their manufacturing processes must be different somehow. It has been suggested that the inlays on BCC chips are, in fact, round but that they are partly covered by clay during the manufacturing process, which makes them look oval. After inspecting some BCC samples, that does not seem to be the case to me. Also, because the PNY design contains a circle around the image, one can clearly see in that case that it is not just the border of the inlay that is deformed, but that the whole inlay is actually distorted. That makes sense, in a way, because it doesn't seem plausible that the whole problem is due to BCC being unable to cut round inlays. Cutting or punching out round inlays should be trivially easy - if that was the only problem, it should have been solved a long time ago.
Instead, it seems, the inlays get deformed during the actual making of the clay chips, i.e. during the compression process. The pressure and the heat might cause the inlay problems somehow. It still seems a little strange, though, that the material of the inlays can get distorted like that without tearing or being otherwise damaged.
So might the difference between BCC and their competitors be that BCC actually presses the inlays into the clay during the compression process while ASM and Paulson apply the inlays only after the clay chips have been manufactured? I think I remember reading about people using leftover blank chips from prior ASM production runs for their custom chips, which would suggest that, in fact, ASM labels are put on the chips after the blank chips have been produced.
What are your thoughts on this?