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Old 07-24-2007, 02:30 PM
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What is the reason for the BCC inlay problems?

I have been wondering about the cause of the infamous BCC inlay problems for a while. I never gave it that much thought, but after reading the thread about warped inlays on the BCC PNY commemorative chips (http://www.chiptalk.net/forum/custom-chips-general/38223-warped-bccs.html), I really became intrigued. A discussion on possible causes for the inlay problems has started in the other thread, but I thought it might be appropriate to start a new thread on this topic.

BCC apparently has always had problems with the roundness of their inlays in the past. Instead of being perfectly round, the inlays are often egg-shaped or otherwise distorted. In addition, you can sometimes see a white ring on the edge of the inlays. The inlays are also often off-center, but that issue is not unique to BCC chips. The other problems are, though.

Inlays on Paulson or ASM chips always seem to be perfectly round, so their manufacturing processes must be different somehow. It has been suggested that the inlays on BCC chips are, in fact, round but that they are partly covered by clay during the manufacturing process, which makes them look oval. After inspecting some BCC samples, that does not seem to be the case to me. Also, because the PNY design contains a circle around the image, one can clearly see in that case that it is not just the border of the inlay that is deformed, but that the whole inlay is actually distorted. That makes sense, in a way, because it doesn't seem plausible that the whole problem is due to BCC being unable to cut round inlays. Cutting or punching out round inlays should be trivially easy - if that was the only problem, it should have been solved a long time ago.

Instead, it seems, the inlays get deformed during the actual making of the clay chips, i.e. during the compression process. The pressure and the heat might cause the inlay problems somehow. It still seems a little strange, though, that the material of the inlays can get distorted like that without tearing or being otherwise damaged.

So might the difference between BCC and their competitors be that BCC actually presses the inlays into the clay during the compression process while ASM and Paulson apply the inlays only after the clay chips have been manufactured? I think I remember reading about people using leftover blank chips from prior ASM production runs for their custom chips, which would suggest that, in fact, ASM labels are put on the chips after the blank chips have been produced.

What are your thoughts on this?
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Old 07-24-2007, 02:44 PM
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Re: What is the reason for the BCC inlay problems?

ASM labels are done totally different from both of these. There are many reports of bubbling of ASM labels and labels just falling off.
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Old 07-25-2007, 08:40 AM
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Re: What is the reason for the BCC inlay problems?

I agree, ASM labels appear to be glued to the chip rather than embeded into the chip. I have had several H mold bubble and then either the label fell off or I pulled it off. Once the label is removed you can see a small spot of dried glue on the chip but it does not cover the entire surface of the insert just a small portion, which is why I think they are bubbling. The other thing I noticed is that when I had bubbles and tried to remove the label to re-glue it, I had to cut around the inlay to remove it. That tells me that ASM must also put a layer of something on top of the label after it is fixed on the chip with glue.

It is my impression based on comments from BCC and others here that they bond the labels after the chips are finished not during the compression process. Several posters have commented that BCC said that the chips were done and they were then going to be labeled. It is possible that they heat the chip to adhere the label and that causes the lables to warp, however, that does not expalin the white rings .

My 2 cents
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Old 07-25-2007, 09:02 AM
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Re: What is the reason for the BCC inlay problems?

But:
The texture on ASM labels watch the actual chip, so the label must be placed before compression. What I would say. But bubbling sucks. On the other hand, the re glueing works pretty good.


But back to topic:
I guess if BCC knew what they're doing wrong, they would fix it
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Old 07-25-2007, 10:17 AM
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Re: What is the reason for the BCC inlay problems?

Quote:
Originally Posted by Vince View Post
But:
The texture on ASM labels watch the actual chip, so the label must be placed before compression. What I would say. But bubbling sucks. On the other hand, the re glueing works pretty good.


But back to topic:
I guess if BCC knew what they're doing wrong, they would fix it

The gluing sucks.
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Old 07-25-2007, 10:53 AM
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Re: What is the reason for the BCC inlay problems?

The ASM inlay coming off problem has been fixed for sometime now. The glue on the inlay is not what holds it down. They use the glue to hold the inlay in place before pressing.
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Old 07-25-2007, 11:09 AM
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Re: What is the reason for the BCC inlay problems?

I've never experienced a problem with ASM, I can't say the same about BCC. I guess if I had to glue an ASM inlay back on I would probably not be happy but having seen what BBC inlays look like when they are applied incorrectly, offset and warped I'm not convinced that BCC is the lesser of the two evils here.
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Old 07-25-2007, 01:39 PM
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Re: What is the reason for the BCC inlay problems?

One comment is whether this problem is unique to the giant inlay (and this run of chips)?

Viet rounder's Duy Palace were giant inlays and I don't think he reported issues...and they aren't prevalent in his photos-
http://www.chiptalk.net/forum/custom...alace-bcc.html


I know there have been a number of BCC custom efforts with the super grand inlay (1 1/4") that I did not see this problem with nor did the buyers report issues such as-

kmalson's Buccaneer Bay- http://www.chiptalk.net/forum/custom...-more-oil.html

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Old 07-25-2007, 02:01 PM
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Re: What is the reason for the BCC inlay problems?

Quote:
Originally Posted by littlebu View Post
The ASM inlay coming off problem has been fixed for sometime now. The glue on the inlay is not what holds it down. They use the glue to hold the inlay in place before pressing.

Someone just posted last week about a problem with an order...I think your thinking of the bubbling, there are 2 different issues.
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Old 07-25-2007, 02:18 PM
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Re: What is the reason for the BCC inlay problems?

Quote:
Originally Posted by KYBill View Post
Someone just posted last week about a problem with an order...I think your thinking of the bubbling, there are 2 different issues.
But those chips were over two years old if I recall, and were probably made at the same time as the others, so even though there was a problem, it was fixed long ago. Sounds like you have a real hate-on for ASM...
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